Communicating configuration information across a programmable analog tile to another tile

ABSTRACT

A programmable analog tile integrated circuit is configured over a standardized bus by communicating tile configuration information from a first integrated circuit tile, through a second integrated circuit tile, to a third integrated circuit tile. Each of the three integrated circuit tiles is part of an integrated circuit. The standardized bus is formed when the tiles are placed adjacent one another. Data bus and control signal conductors of the adjacent tiles line up and interconnect such that each signal conductor is electrically connected to every tile. Tile configuration information may be written to a selected register identified by an address in any selected one of the tiles using the data bus and control lines, regardless of the relative physical locations of the tile sending and the tile receiving the information. Thus, tile configuration information may pass from one tile to another tile, through any number of intermediate tiles.

TECHNICAL FIELD

The disclosed embodiments relate to the field of programmable powermanagement integrated circuits, and more specifically to selecting powermanagement integrated circuit tiles, placing and manipulating the tilesto form a proposed power management integrated circuit, configuring theintegrated circuit and/or programming the integrated circuit to meetspecific customer requirements.

BACKGROUND

FIG. 1 (Prior Art) is a diagram of system 1 involving a type of analogintegrated circuit 2 and a microcontroller integrated circuit 3. Analogintegrated circuit 2 is sometimes called a “Power Management Unit” or“PMU”. It is desired to be able to design and fabricate such a PMU for acustom application in a small amount of time. The custom applicationmay, for example, require that PMU 2 include a number of different typesof analog circuits. The analog circuits may, for example, be derivedfrom integrated circuit Silicon Intellectual Property (SIP) blocks suchas those commercially available from Faraday Technology Corporation ofHsinchu, Taiwan.

The analog circuits are designed and laid out so that they pack togetherand are of irregular shapes as illustrated in FIG. 1. Parts of theanalog circuits may be shared. One example of such an analog circuit isa voltage regulator. The voltage regulator might be configurable tooutput a selectable voltage. The voltage regulator might be configurableso that a current limit of the regulator can be changed. The variousanalog circuits of PMU 2 might be configurable such that if PMU 2 isconfigured in one fashion, then certain of the analog circuits arecoupled to certain of the integrated circuit input/output (I/O)terminals, whereas if PMU 2 is configured in another fashion then theanalog circuits are coupled to others of the I/O terminals. Each of theanalog circuits of PMU 2 may, for example, be configurable so that itcan be enabled or disabled. There are many ways that the various analogcircuits of an analog integrated circuit such as PMU 2 may be designedto be configurable.

However, each PMU is a custom design, which is functionally limited tothe analog circuits that comprise the specific design. Due to theirregular shapes of the analog circuits and the sharing of some analogcircuits, considerable engineering effort is required to significantlyalter the functional capability of a particular PMU. For example, afirst customer may require four channels each outputting a controlledvoltage of a different magnitude and a first design may be made tofulfill the requirement. A second customer may require eight channelseach outputting a controlled voltage of a different magnitude. Tofulfill the additional requirements of the second customer, additionalvoltage regulators may be added to the design for the first customer.Using existing analog circuit design techniques and SIP blocks, aseparate design and significant engineering effort must be directed tomeet the second requirement. The physical layout must be updated, newrouting layers designed, and a revised memory structure designed toaddress each new regulator.

For the same reasons, considerable engineering effort is required tosubstitute an analog circuit of one type for an analog circuit ofanother type to achieve a similar function. For example, to replace abuck converter with a linear voltage regulator, detailed integratedcircuit layout, routing, and layout issues must be resolved by a designengineer to generate physical layout data suitable for integratedcircuit fabrication.

These limitations result in increased engineering costs and time tomarket for custom PMU solutions. Although, PMUs may be designed with alarge range of functionality that may be largely disabled to meet aparticular set of customer requirements, this approach leads to PMUsthat are both costly and large. The PMUs typically include substantialcircuitry that is not utilized in the end product.

SUMMARY

A Multi-Tile Power Management Integrated Circuit (MTPMIC) includes aplurality of programmable Power Management Integrated Circuit (PMIC)tiles of regular shape. The programmable PMIC tiles are placed adjacentone another. Each programmable PMIC tile has a shape that conforms to arectangular grid of fixed pitch to simplify placement of the tiles in anoriginal integrated circuit layout and to simplify the physicalinterchange of tiles in an existing layout. Each programmable PMIC tileincludes a bus portion comprised of conductors capable of transmittingdigital signals, analog signals, and power signals. Each bus portionalso includes a link portion that connects the respective bus portionsof tiles disposed adjacent one another to form a standardized bus. Thestandardized bus electrically and operatively connects each PMIC tile ofa MTPMIC to every other PMIC tile in the MTPMIC. Furthermore, each PMICtile contains writable registers of memory structures. Configurationinformation that configures the functional circuitry of the PMIC tile isstored in the PMIC tile itself in the writable configuration register ofthe PMIC. Each of these configuration registers of the MTPMIC isindividually addressable and writable via the standardized bus.

In one novel aspect, an “Analog Tile Selection, Placement, Configurationand Programming” (ATSPCP) tool serves a webpage. The webpage iscommunicated across a network (for example, the Internet) to a remotelylocated user. The webpage includes a power management characteristicquery. The user responds to the query (for example, using the user's webbrowser). The user response to the query is communicated back across thenetwork to the ATSPCP tool. In response to receiving the user response,the ATSPCP tool selects a number of PMIC tiles. When combined in aMTPMIC and properly configured, these selected PMIC tiles are capable ofmeeting the user requirements derived from the user response. Once alayout of the selected PMIC tiles is decided upon by the user, theATSPCP tool combines physical layout data of each of the selected PMICtiles to form composite physical layout data for the overall MTPMIC. TheATSPCP is able to perform this combination operation automaticallybecause there is no need for custom designed routing layers or memoryfeatures to realize the functional MTPMIC. Each of the selected PMICtiles contains memory for storing the required tile configurationinformation to configure the PMIC tile. Moreover, the standardized busthat is formed when the PMIC tiles are disposed adjacent one anotherprovides all required signal communication.

In a second novel aspect, the Internet-accessible ATSPCP toolcommunicates a graphical representation of a first PMIC tile in a firstposition with respect to a second PMIC tile. The graphicalrepresentation may, for example, be or include a rectangle thatrepresents the boundaries of the first PMIC tile. The ATSPCP toolreceives a first user response to the first graphical representationover the Internet. The first user response indicates a preference tomove the second PMIC tile with respect to the first PMIC tile such thatthe two tiles abut one another. In response to the first user response,the ATSPCP tool sends a second graphical representation of the firstPMIC tile in a second position with respect to the second PMIC tile overthe Internet. The user views the first and second PMIC tiles in the newposition. The user then indicates satisfaction with the secondpositioning of the two tiles by sending a second user response back tothe ATSPCP tool. The ATSPCP tool receives a second user response andthen generates physical layout data for an MTPMIC that contains thefirst PMIC tile in the second position with respect to the second PMICtile.

Due to the regular shape of each PMIC tile, the placement andarrangement and rearrangement of individual PMIC tiles with respect toone another in an integrated circuit layout is greatly simplified. Tileplacement may be accomplished by remote users with minimal training inanalog circuit design using the ATSPCP tool. Users manipulate simplifiedgraphical representations of PMIC tiles that are rendered by the users'web browsers. The simplified graphical representations do not containdetailed layout information of each tile and detailed layout informationis not present on the users' computers. Due to the design of the tiles,there is no need for complex custom signal routing layers to connect thetiles. Placing the PMIC tiles adjacent one another forms thestandardized bus. Accordingly, in response to a user response indicatingsatisfaction with a placement of PMIC tiles, the ATSPCP tool cangenerate physical layout data suitable for fabricating an integratedcircuit that meets user requirements.

In a third novel aspect, the ATSPCP tool communicates a power managementcontrol characteristic query and receives a user response to the queryfrom across a network. In response, the ATSPCP tool generates tileconfiguration information useable to configure PMIC tiles when the tileconfiguration information is stored in the configuration registers ofeach PMIC tile. An individual one of the writable configurationregisters in a selectable one of the PMIC tiles can be loaded with tileconfiguration information to control tile operational characteristics.For example, an individual PMIC tile may include configurable analogcircuitry such as a configurable battery charger circuit. Theconfigurable battery charger circuit may be configured to have aselectable regulated output voltage, to have a selectable output currentlimit, and to be selectably disabled and enabled. An individual one ofthe writable registers in a selectable one of the PMIC tiles can beloaded with configuration information.

Each PMIC tile includes its own writable configuration registers.Configuration information stored in the writable configuration registerof a PMIC tile controls the operational characteristics of thefunctional circuitry of the tile. By storing tile configurationinformation in each PMIC tile in such memory structures, a MTPMIC mayeasily be assembled without having to design a custom, centralizedmemory structure for each new MTPMIC design. Furthermore, there is noneed to contemplate and adapt tile configuration information to thisstructure. For each tile, the function determined by the configurationinformation bit values stored in each writable configuration register ispre-determined. Thus, the ATSPCP tool can quickly and automaticallygenerate tile configuration information useable to configure each PMICtile for a new MTPMIC design based on the response to the powermanagement control characteristic query.

In a fourth novel aspect, the ATSPCP tool communicates a powermanagement control characteristic query and receives a user response tothe query from across a network. In response to the user response, theATSPCP tool programs the PMIC tiles that make up the MTPMIC. The memorystructure of each PMIC tile is individually addressable via thestandardized bus, which is formed when the selected tiles are placedtogether to form a proposed MTPMIC. Furthermore, the memory for storingtile configuration information for each PMIC tile is pre-determined andpresent in each individual tile. Thus, the ATSPCP tool quickly andautomatically programs the tiles of the MTPMIC based on the response tothe power management control characteristic query. The configurationinformation is communicated across the standardized bus to the variousPMIC tiles being programmed. The programming can occur either at thelocation of the computer that executes the ATSPCP tool and/or at aremote location of the user.

In a fifth novel aspect, a programmable analog tile integrated circuitis configured over a standardized bus by communicating tileconfiguration information from a first PMIC tile, through a second PMICtile, to a third PMIC tile. Each of the three PMIC tiles is part of anintegrated circuit. Because the standardized bus is formed when the PMICtiles are placed adjacent one another, the data bus and control signalconductors of the adjacent tiles line up and interconnect with oneanother in an appropriate manner so that each PMIC tile is electricallyand operatively connected to every other PMIC tile. There is no need forcomplex, custom routing layers to direct tile configuration informationfrom one tile to another. Tile configuration information may be writtento a selected register in any selected one of the PMIC tiles using thedata bus and control lines of the standardized bus, regardless of therelative physical locations of the PMIC tile sending and the PMIC tilereceiving the information. Thus, tile configuration information may passfrom one PMIC tile to another PMIC tile, through any number ofintermediate PMIC tiles. The modular tile architecture and design tooldescribed here shorten integrated circuit development times, and mayallow a user of the architecture and ATSPCP tool to obtain design winsdue to the user being able to design and provide a custom integratedcircuit that meets specifications set by a prospective customer in asmall amount of time as compared to more conventional integrated circuitdesign and layout techniques.

Other embodiments and advantages are described in the detaileddescription below. This summary does not purport to define theinvention. The invention is defined by the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, where like numerals indicate like components,illustrate embodiments of the invention.

FIG. 1 (prior art) is a diagram illustrative of a conventional PowerManagement Unit (PMU).

FIG. 2 is a diagram illustrative of a Power Management IntegratedCircuit (PMIC) comprised of novel PMIC tiles. The boundaries of the PMICtiles conform to a layout grid. The PMIC tiles include pre-definedmemory structures and bus portions which automatically connect to form astandardized bus when PMIC tiles are placed adjacent one another.

FIG. 3 is a diagram illustrative of some possible shapes of PMIC tiles.

FIG. 4 is a diagram illustrative of the details of the connection of busportions of multiple PMIC tiles to form a standardized bus.

FIG. 5 is a simplified flowchart of an operation of a novel Analog TileSelection, Placement, Configuration and Programming (ATSPCP) tool. Userrequirements are solicited, and PMIC tiles are selected, placed,configured and programmed to meet the user requirements.

FIG. 6 is a diagram illustrative of system and method involving theATSPCP in one novel aspect.

FIGS. 7A-7C are diagrams illustrative of a power managementcharacteristic query soliciting input source information, power outputrequirement information, and control I/O requirements, respectively, inaccordance with the novel aspect of FIG. 6.

FIG. 8 is a diagram illustrative of integrated circuit tile optionspresented to the user in accordance with the novel aspect of FIG. 6.

FIG. 9 is a diagram illustrative of a graphical representation ofselected tiles in accordance with the novel aspect of FIG. 6.

FIG. 10 is a diagram illustrative of a multi-tile integrated circuit inaccordance with the novel aspect of FIG. 6. The multi-tile integratedcircuit is comprised of abutting graphical representations of theselected tiles.

FIG. 11A-11B are diagrams illustrative of graphical representations ofavailable parts and a selected available part, respectively, that meetthe requirements solicited in FIG. 6.

FIG. 12 is a diagram illustrative of a combined proposal to meet therequirements of FIG. 6. The combined proposal includes both a multi-tileintegrated circuit (involving PMIC tiles) and an external, discretecomponent.

FIGS. 13A-13B are diagrams illustrative of a method of placing andmanipulating PMIC tiles in accordance with a second novel aspect.

FIG. 14 is a diagram illustrative of a method of recording anarrangement of PMIC tiles.

FIG. 15 is a diagram illustrative of a webpage communicating a recordedarrangement. The recorded arrangement includes a multi-tile integratedcircuit and an external, discrete component.

FIG. 16 is a diagram illustrative of a printed circuit boardimplementation of a circuit that satisfies the user requirements. Theimplementation is based on the recorded arrangement of FIG. 15.

FIG. 17 is a diagram illustrative of combining the specifications ofindividual tiles into a combined specification for a MTPMIC thatincludes the individual tiles.

FIG. 18 is a diagram illustrative of a method of generating tileconfiguration information in accordance with a third novel aspect.

FIGS. 19A-19B are diagrams illustrative of control requirementinformation and tile configuration information, respectively.

FIG. 20 is a diagram illustrative of a method of configuring a PMIC tilethat is part of a MTPMIC.

FIG. 21 is a diagram illustrative of a method of programming two unitsof a MTPMIC of the same type in two different ways in accordance with afourth novel aspect.

FIG. 22 is a diagram illustrative of the details of configuring twotiles to share a common bus conductor and the signal path of tileconfiguration information passing from a first tile, through a secondtile, to a third tile in accordance with a fifth novel aspect.

FIG. 23 is a simplified flowchart of a method of soliciting userrequirements and of programming a MTPMIC to meet the user requirements.

FIG. 24 is a simplified flowchart of a method of selecting a PMIC tilein accordance with the novel aspect of FIG. 6.

FIG. 25 is a simplified flowchart of a method of manipulating agraphical representation of a first PMIC tile with respect to a secondPMIC tile and generating physical layout data for a MTPMIC including thefirst and second PMIC tiles in accordance with the novel aspect of FIG.13.

FIG. 26 is a simplified flowchart of a method of manipulating agraphical representation of a first tile with respect to a second tilein accordance with the novel aspect of FIG. 13.

FIG. 27 is a simplified flowchart of a method of generating tileconfiguration information in accordance with the novel aspect of FIG.18.

FIG. 28 is a simplified flowchart of a method of programming two unitsof a MTPMIC of the same type in two different ways in accordance withthe novel aspect of FIG. 21.

FIG. 29 is a simplified flowchart of a method of programming a PMIC tilein accordance with the novel aspect of FIG. 21.

FIG. 30 is a simplified flowchart of a method of identifying a proposedPMIC and sending product information for the proposed PMIC.

FIG. 31 is a simplified flowchart of a method of communicating tileconfiguration information in accordance with the novel aspect of FIG.22.

DETAILED DESCRIPTION

Reference will now be made in detail to some embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings.

FIG. 2 is a diagram of a system 300. System 300 includes a PowerManagement Integrated Circuit (PMIC) 301, a microcontroller integratedcircuit 302, and a bus 303. A PMIC is set forth as an example of onetype of integrated circuit that can advantageously employ an “AnalogTile Selection, Placement, Configuration and Programming” (ATSPCP) toolas set forth in this patent document. It is to be understood that a PMICis just one example of many types of integrated circuits that may bedesigned, selected and/or configured using the ATSPCP tool. Otherexamples include a Light Management Unit (LMU), an Energy ProcessingUnit (EPU), and a Power Management Unit (PMU), however, this list is notmeant to be exhaustive.

PMIC 301 includes a selection of regularly shaped integrated circuittiles 305-312 placed adjacent one another. Each tile is shaped toconform to a rectangular grid of fixed pitch to simplify placement ofthe tiles in an original integrated circuit layout and to simplify thephysical interchange of tiles in an existing layout. Tiles 305, 306, and309 are referred to as “buck converter” tiles and each has a voltagestep-down power management function. Tiles 308 and 310 are referred toas “low drop out regulator (LDO)” tiles and each has a voltageregulation function. Tile 311 is referred to as an “input/output (I/O)”tile, which has a signal interface function between the PMIC 301 and itspackage. Tile 307 is referred to as a “battery charger” tile that has apower supply function. Tile 312 is referred to as a “master tile”.Master tile 312 includes a bus interface block 314 and a register ofmemory structures 323 useable to configure functional circuitry of themaster tile. For example, functional circuitry of the master tile 312may include a voltage reference generator and a clock. The clock signaland the signals generated by the voltage reference-generator arecommunicated to the other tiles. Other examples of integrated circuittiles include boost converter tiles which have a step-up powermanagement function, charge pump tiles which have a power supplyfunction, battery and power path management tiles which manage the powersupply to multiple devices, switching power controller tiles whichcontrol the operation of switched mode power supplies, and lightingcontrol module tiles which supply power to direct current (DC) lightingdevices, data converter tiles, to achieve, for example,analog-to-digital or digital-to-analog signal conversion,microcontroller and microprocessor tiles, interface tiles featuring, forexample, USB interfacing capability, and supervisory tiles, for example,a watchdog function for quantities such as voltage, temperature, etc.These tiles may be simply arranged adjacent one another in an integratedcircuit layout because each tile shares a regular shape that conforms toa rectangular grid of fixed pitch, for example, 0.5 millimeters. ThePMIC layout illustrated in FIG. 2 illustrates a simple arrangement oftiles disposed on a regular grid.

For additional detail on the tile architecture, and how the tilesinterconnect and intercommunicate, and how the tiles can be programmablyconfigured, see: 1) U.S. patent application Ser. No. 11/978,458,entitled “Microbump Function Assignment In A Buck Converter”, filed Oct.29, 2007, by Huynh et al.; 2) U.S. patent Ser. No. 11/544,876, entitled“Method and System for the Modular Design and Layout of IntegratedCircuits”, filed Oct. 7, 2006, by Huynh et al.; 3) U.S. provisionalapplication 60/850,359, entitled “Single-Poly EEPROM Structure ForBit-Wise Write/Overwrite”, filed Oct. 7, 2006; 4) U.S. patentapplication Ser. No. 11/888,441, entitled “Memory Structure Capable ofBit-Wise Write or Overwrite”, filed Jul. 31, 2007, by Grant et al.; and5) U.S. patent application Ser. No. 11/978,319, entitled “InterconnectLayer of a Modularly Designed Analog Integrated Circuit”, filed Oct. 29,2007, by Huynh et al; 6) U.S. patent application Ser. No. 11/452,713,entitled “System for a Scaleable and Programmable Power ManagementIntegrated Circuit”, filed Jun. 13, 2006, by Huynh; 7) U.S. provisionalapplication Ser. No. 60/691,721, entitled “System for a Scaleable andProgrammable Power Management Integrated Circuit”, filed Jun. 16, 2005,by Huynh; and 8) U.S. patent application Ser. No. 11/544,876, filed Oct.7, 2006 (the entire subject matter of each of these patent documents isincorporated herein by reference).

FIG. 3 is a diagram illustrative of possible, general shapes of tiles.Tiles 370-374 are not an exhaustive list of possible tile shapes, butrather are simply illustrative examples. For example, tile 370 is anexample of a four-sided polygon shaped tile, tile 373 is an example of asix-sided polygon shaped tile, and tile 374 is an example of aneight-sided polygon shaped tile. In general, each tile shape is closedpolygon wherein each corner of the closed polygon lies on orsubstantially near a gridpoint of a rectangular grid of fixed pitch. Inaddition, each side of the closed polygon lies on or substantially neargridlines, which connect each gridpoint of the rectangular grid of fixedpitch. Following these geometric rules, a wide variety of tile shapesmay be composed and a plurality of these shapes can be assembled intoMTPMICs.

Referring back to FIG. 2, each of the tiles 305-312 includes registersof memory structures 316-323. In the simplified illustration of FIG. 2,each tile is illustrated to include one eight-bit register of memorystructures. These registers are designated with reference numerals316-323. However, each memory structure may include either more or lessbits. Each memory structure may be comprised of volatile bits,non-volatile bits, or a combination of volatile and non-volatile bits.For additional detail on one suitable memory structure, see: U.S. patentapplication Ser. No. 11/888,441, filed Jul. 31, 2007 (the entire subjectmatter of which is incorporated herein by reference).

Each tile contains its own configuration registers of knowncharacteristics, for example bit structure, address, and function ofeach selectable bit value of each register. Each tile does not have torely on external memory to function as part of PMIC 301. It is notnecessary to design a custom, centralized memory structure for PMIC 301.Thus, design modifications can be made to a PMIC without having todesign a new memory structure and address structure to storeconfiguration information. Instead, a predefined memory structure andaddress exists for each tile. Tile configuration information including aregister address and bit configuration information for the register canbe generated automatically once a particular tile function for the tilewithin the PMIC has been defined. Each of the tiles 305-312 iselectrically connected to each other by a standardized bus 350. Each oftiles 370-374 illustrated in FIG. 3 also includes a respective busportion 375-379, which lies along or substantially near at least oneside of a closed polygon shape tile.

FIG. 4 is a diagram illustrative of the details of the formation of aportion of the standardized bus 350 when buck tile 305, buck tile 306,master tile 313, LDO tile 308, LDO tile 310, and buck tile 310 aredisposed adjacent one another in an integrated circuit layout. LDO tile308 includes a bus portion 352, which includes a plurality of busconductors such as bus conductor 354 and a link portion 353. Linkportion 353 includes a plurality of link conductors such as linkconductor 355. When LDO tile 308 is disposed adjacent master tile 312,link conductor 355 electrically connects bus conductor 354 of LDO tile308 with the corresponding bus conductor 356 of master tile 312.Analogously, each bus conductor of the bus portion 352 of LDO tile 308is electrically connected to each corresponding bus conductor of the busportion 357 of master tile 312 via link portion 353. In this manner astandardized bus 350 is formed by simply placing tiles adjacent oneanother in an integrated circuit.

In one embodiment, a functional MTPMIC is created utilizing theconductors of the standardized bus alone without any additional signalrouting layers. Because the placement of tiles adjacent one another inan integrated circuit dictates the standardized bus structure andbecause the physical layout data of each tile is pre-determined,physical layout data for a functional MTPMIC useable for IC fabricationmay be quickly and automatically generated by the ATSPCP tool afterplacement of the tiles in a proposed MTPMIC.

The standardized bus may include dedicated signal conductors,communication signal conductors, control signal conductors, and powersupply and ground conductors. For example, the standardized bus mayinclude seventy distinct conductors. Some contemplated control,communication, and power supply signals include, but are not limited to:(a) “committed”, fixed-purpose signals such as, without limitation,voltage references and voltage sources, current references and currentsources, oscillator signals, clock timing and synchronization signals,data and address signals for programming and communication, analog ordigital electrical trimming signals, various ground signals includinganalog ground, digital ground, and signal ground sense, various powersupply signals including analog core power supply, digital core powersupply, I/O power supply, and Non-Volatile Memory (NVM) programmingpower supply, as well as (b) “uncommitted” analog and/or digitalsignals, which can be claimed by one or more tiles for inter-tileconnections, control, and/or communication. In some embodiments, atleast one of the tiles is configured to control an electrical and/orperformance characteristic at least in part based on information storedin its memory. In some other embodiments of the present invention, atleast one of the tiles is configured to generate a voltage referenceand/or clock signal(s) that are operable for use by at least one of theother tiles.

FIG. 5 is a flowchart illustrative of an operation of an “Analog TileSelection, Placement, Configuration and Programming” (ATSPCP) tool 46.Operational steps include selecting power management integrated circuittiles, placing the selected tiles in a proposed integrated circuit,generating a combined specification for the proposed integrated circuit,generating tile configuration information to program the selected tilesof the proposed integrated circuit, and actually programming the tilesof the proposed integrated circuit. The process begins by solicitinginput source information (step 10), soliciting power output requirementinformation (step 11), and optionally, soliciting control I/Orequirement information (step 12). The information solicited is thenused to evaluate (step 13) whether an available part meets orsubstantially meets the requirements informed by the informationsolicited in steps 10-12. If it is determined in step 13 that at leastone part is available, then available part options are generated (step14). Each of these options is evaluated (step 15) to determine if theoption meets the requirements informed by the information solicited insteps 10-12, or if additional resources are required. If additionalresources are required, then these additional resources are defined(step 16) such that the available part option and the additionalresources meets the requirements informed by the information solicitedin steps 10-12. If it is determined that no part is available that meetsor substantially meets the requirements informed by the informationsolicited in steps 10-12, then individual tile options are generated(step 17), which fulfill a portion of the requirements informed by theinformation solicited in step 10-12. A selection of these individualtiles is made (step 18) and an icon/graphic representing the selectedtile or group of tiles is delivered (step 19). The selection of theseindividual tiles is then evaluated (step 20) to determine if anothertile is required to meet the requirements informed by the informationsolicited in step 10-12. If another tile is required, then the processof steps 17-20 is iteratively repeated beginning at the step 17. If theselection of tiles is determined to meet the requirements informed bythe information solicited in steps 10-12, then the tiles are placed(step 21) in a proposed integrated circuit. Because of the novel tileand standardized bus architecture described above, physical layout datacan be generated (step 22) quickly and automatically after tiles areplaced in a proposed integrated circuit.

In one example, GDS II layout data for each of the selected tiles isretrieved from a library of GDS II tile layout data. The GDS II datadescribes the structure of the various layers of the tile. The retrievedGDS II data for the selected tiles is then combined to generate anamount of composite GDS II layout data for the proposed multi-tileintegrated circuit. At this point, an integrated circuit comprised ofPMIC tiles has been determined.

Control requirement information is solicited (step 23) to determine theprogramming requirements for the proposed integrated circuit. Based onthe control requirement information solicited, a combined specificationfor the proposed integrated circuit is generated (step 24). Tileconfiguration information useable to program each PMIC tile of theMTPMIC is generated (step 25). In one example, a (Universal Serial Bus)USB bus dongle 50 is provided. USB dongle 50 has a socket or othermechanism for making electrical and physical contact with the MTPMIC 51to be programmed. One end of dongle 50 is inserted into a USB port 52 ofthe computer 30 that executes ATSPCP tool 46. The unprogrammed MTPMIC 51is inserted into the socket at the other end of the dongle. ATSPCP tool46, after determining the configuration information as explained above,communicates the configuration information through USB port 52, throughUSB dongle 50, and into MTPMIC 51, into the master tile, and through thestandardized bus on the MTPMIC to the appropriate configurationregisters in the various PMIC tiles, thereby programming and configuringthe various PMIC tiles. The MTPMIC 51 can be repeatedly reprogrammed indifferent ways using dongle 50 if desired.

FIG. 6 is a diagram illustrative of a preferred embodiment of ATSPCPtool 46 communicating with a user 34 over the Internet. In the preferredembodiment, ATSPCP tool 46 is a set of processor-executable instructionsstored on a processor-readable medium. The processor-readable medium maybe, for example, a computer hard disc, a Digital Video Disc (DVD), aCompact Disc (CD), a floppy disc, a solid-state memory device such asRandom Access Memory (RAM), FLASH, Electrically Erasable Read OnlyMemory (EPROM), or a removable memory drive. The instructions stored onthe processor-readable medium are read by a computer and executed by thecomputer. In other embodiments, ATSPCP 46 is executed on a computer andmay communicate with a user directly via a display or remotely via anetwork such as a Local Area Network (LAN).

In the preferred embodiment illustrated in FIG. 6, a first computer 30is connected to a first network port 35 which accesses the Internet 31to reach a second network port 32 connected to a second computer 33operated by user 34. The ATSPCP tool 46, executed on computer 33,communicates a power management characteristic query 36 to user 34 viathe Internet 31. A user response 37 to the query is communicated back tothe selection tool based on the user response 37, the ATSPCP tool 46selects a power management integrated circuit tile 38. In the preferredembodiment, query 36 includes a webpage or series of webpages renderedby a web browser operating on computer 33 such as Microsoft InternetExplorer and displayed to the user via the computer display. In otherembodiments, the query 36 may be generated by software running on acomputer, which displays the query directly to the user via the computerdisplay.

FIG. 7A illustrates an example of power management characteristic query36 displayed to user 34 as a webpage 40, soliciting input sourceinformation. In this example, input source information includes a userselection 41 of a battery as a primary source type and a user entry 42of a maximum current of one ampere for a wall adaptor to be used as asecondary source type. A user selection is a selection of optionsspecified in the query. For example, user selection 41 is a check markin a dialog box and is included as part of user response 37 to query 36.A user entry is an indication of magnitude of parameters specified inthe query. For example, user entry 42 is a numerical quantity indicatingthe maximum current required of the wall adaptor and is part of the userresponse 37 to the query 36. Examples of input source information 43include input voltage information such as the supply voltage entry ofwebpage 40 and input current information such as the maximum currententry of webpage 40. Other examples of input source information mayinclude limits on voltage or current rates. This example is notexhaustive; many other parameters may be solicited from a user as partof the solicitation for input source information.

FIG. 7B illustrates an example of power management characteristic query36 displayed to user 34 as a webpage 44, soliciting power outputrequirement information. Examples of power output requirementinformation 45 include the number of power supply output channels andoutput voltage information and output current information associatedwith each channel. FIG. 7B illustrates a minimum current requirementassociated with each channel as an example of output current informationand an output voltage requirement as output voltage information 45. Thisexample is not exhaustive; many other parameters may be solicited from auser as part of the solicitation for power output requirementinformation.

FIG. 7C illustrates an example of power management characteristic query36 displayed to user 34 as a webpage 50, soliciting control I/Orequirements. Examples of control I/O requirements illustrated in FIG.7C include a quantity of ON/OFF control inputs, a quantity of resetinputs, a quantity of reset outputs, and a quantity of interruptoutputs. This example is not exhaustive; many other parameters may besolicited from a user as part of the solicitation for control I/Orequirements. In some embodiments, there is no solicitation for controlI/O requirements.

FIG. 8 is a diagram illustrative of integrated circuit tile optionsdisplayed to user 34 as a webpage 60. In the preferred embodiment, alist of integrated circuit tile options is generated by the ATSPCP tool46 based on the user response 37 to the power management characteristicquery 36. Webpage 60 is a solicitation for a user response indicatingthe quantity and type of integrated circuit tiles preferred by user 34to meet the requirements informed by the information solicited in thepower management characteristic query 36. Based on the user response towebpage 60, the ATSPCP tool 46 selects a plurality of power managementintegrated circuit tiles. In another embodiment, the ATSPCP tool 46selects a power management integrated circuit tile directly in responseto the user response 37 to the power management characteristic query. Insome embodiments, a graphical representation (for example, a rectangularrepresentation of the boundaries) of the power management integratedcircuit tile is selected. In other embodiments, a textual representationof the power management integrated circuit tile is selected.

FIG. 9 is a diagram illustrative of graphical representations ofselected tiles displayed to user 34 as a webpage 70. In the preferredembodiment, the displayed tiles are presented to the user in a simplegraphical or icon form and do not contain detailed information of thephysical features of the circuitry. For example, power managementintegrated circuit tile 71 is presented as a simple square shaperepresentative of the actual physical shape of the tile and a textualidentifier of the tile. There are no details presented concerning theinternal functional circuitry of tile 71.

FIG. 10 is a diagram illustrative of another example of a graphicalrepresentation of selected tiles displayed to user 34 as a webpage 72.In this example, the ATSPCP tool 46 communicates a simple graphicalrepresentation or icon of the selected integrated circuit tiles in aproposed integrated circuit. Because of the novel standardized busstructure discussed above, physical layout data suitable for integratedcircuit fabrication can be directly generated by ATSPCP 46 for theintegrated circuit displayed in webpage 72. ATSPCP tool 46 can generatethe physical layout data based on the known physical layout data of eachindividual tile. ATSPCP tool 46 may automatically place the tiles asdisplayed in webpage 72.

In another embodiment ATSPCP tool 46 generates a list of availableMTPMICs in response to the requirements informed by the user response 37of the power management characteristic query 36. The available parts maymeet the requirements or substantially meet the requirements asdiscussed above.

FIG. 11A is a diagram illustrative of a textual representation ofavailable MTPMIC parts communicated to a user 34 as a webpage 80.Available parts are presented to the user to solicit user preference forthe quantity and type of available integrated circuit parts preferred bya user 34 to meet the requirements informed by the information solicitedin the power management characteristic query 36. In response to thesolicitation of webpage 80, the selection tool selects an availableintegrated circuit part.

FIG. 11B is a diagram illustrative of a graphical representation of aselected available part communicated to a user 34 as a webpage 81. Thesimple graphical or icon form includes an indication of the relativedimensions of PMIC tiles and an identifier for each tile, but does notcontain detailed information of the physical features of the circuitry.

In the case where the selected available integrated circuit part doesnot meet the requirements informed by the information solicited in thepower management characteristic query 36, additional discrete componentsmay be selected by ATSPCP tool 46 to meet the requirements. Thisselection may be made directly by the selection tool or informed by asolicitation of user preference for discrete components. The discretecomponents are additional elements that are external to the integratedcircuit.

FIG. 12 illustrates a webpage 82 communicated to a user 34 that includesa graphical representation of a “combined proposal” to meet therequirements. The combined proposal includes an available integratedcircuit 47 and at least one discrete component 48. Available integratedcircuit 47 and discrete components 48 and 49 can satisfy the userrequirement if the integrated circuit 47 and components 48 and 49 areinterconnected appropriately on a printed circuit board.

FIG. 13 illustrates novel ATSPCP tool 46 communicating with a user overthe Internet. In the preferred embodiment, tool 46 is a set ofprocessor-executable instructions stored on a processor-readable medium.The processor-readable medium may be, for example, a computer hard disc,a DVD, a CD, a floppy disc, a solid-state memory device such as RAM,FLASH, EPROM, or a removable memory drive. The instructions stored onthe processor-readable medium are read by a computer and executed by thecomputer. In other embodiments, the placement tool operating on acomputer may communicate with a user directly via a display or remotelyvia a network such as a Local Area Network (LAN).

In the preferred embodiment illustrated in FIGS. 13A and 13B, a computer93 is connected to the Internet 92 and a display 91 renders a webpage 90including content communicated from the computer 93. FIG. 13Aillustrates, in a first step, the tool 46 executed on computer 93,communicating a first graphical representation 94 across the Internet92. Display 91 renders the graphical representation 94 in a webpage 90.The webpage 90 illustrates individual integrated circuit tiles that havenot been placed together to form a proposed integrated circuit. In asecond step, a response 95 to the graphical representation 94 isreceived by the tool 46 indicating a user preference to place the tilestogether to form a proposed integrated circuit.

FIG. 13B illustrates, in a third step, the tool 46 communicating asecond graphical representation 98 across the Internet 92. Display 91renders the graphical representation in a webpage 96. The webpage 96illustrates individual integrated circuit tiles placed together to formpart of a proposed integrated circuit. The user may perform a drag anddrop operation 97 to move representations of the tiles of FIG. 13A sothat they form a proposed integrated circuit as illustrated in FIG. 13B.In a fourth step, a response 99 is received by computer 93 indicatinguser satisfaction with the proposed integrated circuit tile placement.In response, in a fifth step, the tool 46 generates physical layout datafor fabrication for the proposed integrated circuit.

FIG. 14 is a diagram illustrative of another embodiment of the operationof ATSPCP tool 46 including a recording step. In a first step, acomputer 114 executing the ATSPCP tool 46 receives a response 112.Response 112 indicates user satisfaction with an approved arrangement ofa proposed integrated circuit graphically represented in a webpage 111by display 110. In response to response 112, the ATSPCP tool 46 recordsthe approved arrangement 113 on a memory device accessible by computer114 as a recorded arrangement.

FIG. 15 illustrates another step of displaying via webpage 115 agraphical representation of a recorded arrangement that includes anintegrated circuit and at least one discrete component.

FIG. 16 illustrates a design of a portion of a printed circuit boardbased on the recorded arrangement illustrated in FIG. 15.

FIG. 17 illustrates combining the specifications of three individualtiles 120-122 into a combined specification 123 for an integratedcircuit comprising the three tiles. Combined specifications may includepackage data, for example, pinout data, dimension data, pitch of leads,application data, and performance specifications for the integratedcircuit.

FIG. 18 is illustrative of the operation of ATSPCP tool 46 in accordancewith another novel aspect. In the preferred embodiment, ATSPCP tool 46is a set of processor-executable instructions stored on aprocessor-readable medium. The processor-readable medium may be, forexample, a computer hard disc, a DVD, a CD, a floppy disc, a solid-statememory device such as RAM, FLASH, EPROM, or a removable memory drive.The instructions stored on the processor-readable medium are read by acomputer and executed by the computer. In other embodiments, ATSPCP tool46 operating on a computer may communicate with a user directly via adisplay or remotely via a network such as a Local Area Network (LAN).

A computer 133 is connected to the Internet 132 and a display 130renders a webpage 131 including content communicated from the computer133. In a first step, ATSPCP tool 46, executed by computer 133,communicates a power management control characteristic query 134 acrossthe Internet 134. Display 130 renders the query in webpage 131. Thewebpage 131 includes a solicitation for control requirement information.In a second step, a response 135 to the query 134 is received by thetool 46 indicating user preferences for control characteristics. Inresponse, in a third step, the tool 46 generates tile configurationinformation 136.

FIG. 19A illustrates an example power management control characteristicquery included in webpage 140 soliciting control requirementinformation. For example, questions are specifically directed toward thedesired characteristics of each tile to elicit control requirements. Forthe master tile, these questions include a preference for interfaceprotocol, clock frequency, reset timeout period, push button interface,reference bypass, a desired register controlling a first tile ON/OFFstate and the polarity of that state. Additional questions arespecifically directed toward the desired characteristics of a first bucktile. These questions include a preference for standby voltage,operational mode, switching frequency, switching phase, fault interrupt,whether tracking should be enabled or not, and whether the tile shouldautomatically turn on with a signal from the master tile. The responsesto questions associated with each individual tile forms a part of theindividual tile specification for each tile that will operate in amulti-tile integrated circuit.

Due to the novel memory structure discussed earlier, in the preferredembodiment, the memory present in each individual tile stores the tileconfiguration information for that tile alone. An address to identifythe memory and the function of each bit value stored in eachconfiguration register is pre-determined. Thus, the control requirementinformation solicited for each tile as illustrated in FIG. 19A can bedirectly mapped to specific tile configuration information for eachindividual tile. As illustrated in FIG. 19B, tile configurationinformation is a bit string representative of the bit values to bestored in each configuration register of each tile in a MTPMIC. In theexample of FIG. 19B, the bit string of configuration information to beloaded into the “BUCK_(—)1 REGISTER” is “10010110”. In this manner, tileconfiguration information directly useable to configure an integratedcircuit tile when stored in its configuration register can be directlygenerated in response to a power management control characteristic queryfor any multi-tile integrated circuit in which the tile is a part. Thereis no need to reference a custom memory structure for each integratedcircuit design to establish the appropriate bit string and registeraddresses.

FIG. 20 illustrates an example of configuring a tile with the tileconfiguration information 136 generated by ATSPCP tool 46. In thesimplified illustration of FIG. 20, each tile is illustrated to includeone eight-bit register of memory structures. These registers aredesignated with reference numerals 316-322. Bus interface block 314 inmaster tile 312 is coupled by a common data bus DIN[7:0] to the memorycells in each of the tiles. In the preferred embodiment the common databus is part of the standardized bus 350 illustrated in FIG. 2. It isdrawn separately in FIG. 20 for illustrative purposes.

In the present example, the tiles embody analog power control circuitrythat is to be configured and controlled. An example of such circuitry isa constant current and constant voltage (CC-CV) battery charger circuitin tile 307. This charger circuit is to supply charge current to abattery that is external to integrated circuit 301. The voltage outputby the charger circuit is a regulated voltage whose magnitude isdetermined by a first value stored into various ones of the memorystructures of register 318. The current limit of the charger circuit isalso programmable and is determined by a second value stored intovarious other ones of the memory structures of register 318. The chargercircuit can also be disabled or enabled. Whether the charger circuit isenabled or disabled is determined by a third value stored into anotherone of the memory structures of register 318.

In one embodiment, each of the memory structures includes a non-volatilecell and a volatile cell. Upon power up of integrated circuit 301, thedata content of the non-volatile cell is automatically transferred intothe volatile cell. The data stored in the volatile cell in turn issupplied to the circuitry in tile 307 to configure and control thecircuitry in tile 307. In one example, upon initial power up ofintegrated circuit 301, the non-volatile cells of the memory structuresof register 318 power up into logic states such that the charger circuitin tile 307 is disabled. Thereafter, microcontroller 302 writes valuesinto the memory structures of register 318 so as to configure the outputvoltage and the current limit of the charger circuit. Thereafter,microcontroller 302 writes the appropriate value into the appropriatememory structure of register 318 so as to enable the charger circuit.The charger circuit then functions to charge the external battery orexternal device as desired.

If system 300 were then to be powered down and powered up again, themicrocontroller 302 would need not reconfigure the memory structures intile 307 because the prior configuration information would have beenstored in the non-volatile cells of register 318. The data content ofthe non-volatile cells would be automatically loaded into thecorresponding volatile cells of register 318 so that the configurationinformation would then configure and control the circuitry of tile 307.

In the illustrated example, each of tiles 305-311 is coupled to receivethe same data bus DIN[7:0], the same programming voltage conductor, andthe same program signal conductor. The programming voltage conductor andthe program signal conductor are designated by arrows labeled VPP andPGM. In addition to each of the tiles receiving these common conductors,each tile is coupled to receive its own local clock signal from mastertile 312. The local clock signal supplied to tile 307 is identified bythe reference numeral L. Local clock signal L is received by register318 via clock signal conductor 326. The clock signal for only one of theregisters is made to transition at a time. Which particular clock signalis allowed to transition depends on the value of an address ADR that isloaded through the bus interface block 314.

If, for example, microcontroller 302 is to write data into register 318in tile 307, then microcontroller 302 supplies an address ADR via bus303 to bus interface block 314. The address ADR is latched into businterface block 314. Decoder 315 decodes the address. AND gates 324allow a clock signal to be supplied on only one of the clock outputlines. In this example where the address ADR identifies register 318 intile 307, decoder 315 will allow a clock signal to pass from globalclock conductor 325 to the local clock conductor 326 and to register318.

Microcontroller 302 then writes the data to be written into register 318into the bus interface block 314 via bus 303. This data is in turnsupplied to all the registers of integrated circuit 301 via data busDIN[7:0]. The bus interface block 314 then asserts the clock signal onglobal clock conductor 325, thereby supplying a local clock signal tothe register that is addressed by address ADR. In the present example,the local clock signal L is supplied to register 318. This local clocksignal L clocks the data from data bus DIN[7:0] into the volatile cellsof register 318. In this way, microcontroller 302 can write data intothe volatile cells of any desired one of the registers 316-322 ofintegrated circuit 301.

Once data has been written into the volatile cells of the desiredregister, a programming pulse signal is supplied to integrated circuit301. This programming pulse signal is supplied to all the memorystructures of all the registers 316-323 of integrated circuit 301. Eachvolatile cell in register 318 has a corresponding non-volatile cell. Ifthe data content of the non-volatile cell differs from the data storedin the volatile cell, then the non-volatile cell is programmed to storethe same data stored in the volatile cell. If the data content of thenon-volatile cell does not differ from the data stored in the volatilecell, then the digital logic state stored in the non-volatile cell isnot changed. In another embodiment, a programming pulse signal isgenerated on board integrated circuit 301. In this manner, fieldprogramming of integrated circuit 301 can be achieved. For example,changes to volatile memory during system operation can be made totransition to a sleep mode or a power down mode.

FIG. 21 is an illustration of ATSPCP tool 46 in accordance with anothernovel aspect. In the preferred embodiment, ATSPCP tool 46 is a set ofprocessor-executable instructions stored on a processor-readable medium.The processor-readable medium may be, for example, a computer hard disc,a DVD, a CD, a floppy disc, a solid-state memory device such as RAM,FLASH, EPROM, or a removable memory drive. The instructions stored onthe processor-readable medium are read by a computer and executed by thecomputer. In other embodiments, ATSPCP tool 46 operating on a computermay communicate with a user directly via a display or remotely via anetwork such as a Local Area Network (LAN).

In a first step the ATSPCP tool 46 receives a first requirement 177 froma first entity 171. In a second step, tool 46 identifies a first unit ofa particular type of multi-tile power management integrated circuit(MTPMIC). In a third step, the identified first unit is programmed inaccordance with a program designed to meet the first requirement. Theprogram is the tile configuration information necessary to configureeach tile of the MTPMIC. The programmed first unit is delivered to thefirst entity. In a fourth step, ATSPCP tool 46 receives a secondrequirement from a second entity. In a fifth step, ATSPCP tool 46identifies a second unit of the same type of MTPMIC as the first unit.In a sixth step, the identified second unit is programmed in accordancewith a program designed to meet the second requirement. The program isthe tile configuration information necessary to configure each tile ofthe MTPMIC to meet the second requirement. The programmed second unit isdelivered to the second entity. Units of the same type are the same orsubstantially similar.

An aspect of the preferred embodiment is ease with which the same typeof MTPMIC can be reconfigured to meet different customer requirements.The power management integrated circuit 301 introduced in FIG. 2 isreproduced in simplified form in FIG. 22. For example, each buckconverter tile can deliver one channel of output voltage of five voltsat a maximum current of one ampere. If the first requirement of thefirst entity requires three channels of output voltage at 3.3 volts at amaximum current of one ampere, each of the three buck tiles can beconfigured to deliver one channel of required voltage by configuring theoutput voltage of each buck tile to 3.3 volts with the appropriate tileconfiguration information in a manner analogous to the discussion ofFIG. 20. A second requirement from a second entity requires one channelof output voltage at 3.3 volts with a maximum current of two amperes. Inone embodiment, this requirement can be satisfied by programming anotherunit of the same type by disabling one buck tile and connecting theremaining two buck tiles in a two-phase buck converter arrangement toprovide increased power supply output capability. In this arrangement, afirst buck tile is programmed with an output phase of zero degrees and asecond buck tile is programmed with an output phase of one hundredeighty degrees. Furthermore, a common pulse width modulation controlsignal is shared by both buck converters to achieve increased poweroutput supply capability. For example, in a master/slave arrangement,the pulse width modulation control signal generated by the first bucktile is not only used for control of the first buck tile, but is alsocommunicated to the second buck tile for control of the second bucktile.

A portion of power management integrated circuit 301 illustrated in FIG.22 is depicted to illustrate the details of configuring the connectionof two buck tiles to meet the second requirement in the manner discussedabove. Each tile includes a bus portion, an input/output interfaceportion, a memory portion, and a functional portion. Buck tile 305includes functional circuitry 380 that generates a pulse widthmodulation control signal 387 that is communicated to an input/outputinterface 383 on signal line 385. Similarly, buck tile 306 includesfunctional circuitry 381 that receives the pulse width modulationcontrol signal 387 that is communicated from an input/output interface382 on signal line 386. To meet the second requirement the pulse widthmodulation signal 387 must be communicated over a bus conductor frominput/output interface 383 to input/output interface 382.

The interface portion of a tile includes a set of multiplexers anddemultiplexers. The multiplexers and demultiplexers can be controlled tocouple a desired one of the bus conductors to a desired one of a set ofnodes. The functional circuitry is fashioned such that a signalconductor that is either to receive information from another tile orthat is to output information to another tile is coupled to this node.By appropriate control of the multiplexers and demultiplexers in theinterface portion, the signal conductor of the functional circuitry iscoupled through the interface portion to a desired one of the busconductors. Due to the way the conductors of the standardized bus areinterconnected from tile to adjacent tile, the desired bus conductorextends to all the interface portions of all the tiles of the integratedcircuit. The interface portion of one tile can therefore be configuredto couple the conductor to a desired node of functional circuitry withinanother tile.

In the specific example of FIG. 22, each respective one of the signallines 385 and 386 is connected to a corresponding node on interfaceportion 383 and 382 respectively. The memory portion of each tile storesconfiguration information in non-volatile memory cells. Thisconfiguration information is supplied to and from the tile's functionalcircuitry to control the functional circuitry, and to the interfaceportion of the tile to control how the multiplexers and demultiplexerswithin the interface portion are configured. Accordingly, by changingthe contents of the configuration information stored in the memoryportions, the configuration of the multiplexers and demultiplexers inthe interface portions of integrated circuit 121 can be changed.

In the illustrated example of FIG. 22, the memory portion 316 of bucktile 305 and the memory portion 317 of buck tile 306 are loaded withtile configuration information such that signal line 385 of functionalcircuitry 380 of buck tile 305 is coupled through interface portion 383and interface portion 382 to signal line 386 of functional circuitryportion 381 of buck tile 306.

The memory portions of the various tiles are loaded with configurationinformation through master tile 312 in a manner analogous to thedescription of FIG. 20. The signal path of the tile configurationinformation from the bus interface 314 of master tile 312 to memoryportion 316 of buck tile 305 is illustrated in FIG. 22. In another novelaspect, a programmable analog tile integrated circuit is configured overa standardized bus by communicating tile configuration information froma first integrated circuit tile, through a second integrated circuittile, to a third integrated circuit tile. Each of the three integratedcircuit tiles are part of an integrated circuit. In the example of FIG.22, the conductors that form the standardized bus route the tileconfiguration information from the master tile 312 through the buck tile306 to the buck tile 305. In another embodiment, master tile 312provides a reference voltage, a clock signal, and other shared resourcesto all tiles via the standardized bus.

Similarly, power supply tiles can be configured for parallel ormulti-phase operation. Tile outputs can be cascaded or connected inseries, where one tile output becomes the input supply to anothermodule. Depending on the particular requirements, those skilled in theart will readily recognize a multiplicity of alternative and suitabledynamically configurable architectures that can be realized by simplyprogramming each tile to operate in a selectable number of ways and toconnect tiles together in a flexible manner. All of this can be achievedwithout having to rework the layout of the IC or perform designvalidation, circuit simulations, or physical design verification becausethe standardized bus makes all signal lines available to each tile andtile configuration information can be generated for each tile thatconnects each tile to the standardized bus in the appropriate manner.For additional detail on configuring tiles to communicate with oneanother, see: U.S. patent application Ser. No. 11/978,458, filed Oct.29, 2007 (the entire subject matter of which is incorporated herein byreference).

FIG. 23 is a flowchart illustrative of one example of steps to programpower management integrated circuit tiles to meet customer requirements.The process begins by soliciting input source information 150, poweroutput requirement information 151, control I/O requirement information,and control requirement information 153. Solicitation of control I/Orequirement information is optional. In some embodiments, information150-153 is solicited as part of a power management characteristic queryand a power management control characteristic query. The informationsolicited is used to evaluate 154 whether an available part meets orsubstantially meets the requirements informed by the informationsolicited in 150-153. If at least one part is available, available partoptions are generated 155. Each of these options is evaluated 156 todetermine if the option meets the requirements informed by theinformation solicited in 150-153, or if additional resources arerequired. If additional resources are required, these additionalresources are defined 157 such that the available part option and theadditional resources meets the requirements informed by the informationsolicited in 150-153. If it is determined that no part is available thatmeets or substantially meets the requirements informed by theinformation solicited in 150-153, then custom PMIC options are generated158, which fulfill the requirements informed by the informationsolicited in 150-153. Product information relevant to PMIC optionsgenerated by 158 and/or 155-157 is sent to an entity, such as aprospective customer 159. Product information may include priceinformation, lead time information, a solicitation for additionalcontrol requirement information, and ordering information. This list isnot meant to be exhaustive. A response to the product information isreceived 160 and delivery of an MTPMIC is initiated based on theresponse 162.

FIG. 24 is a flowchart of a method 405. A power managementcharacteristic query is communicated (step 400) to a user, such as aprospective customer. A response to the query is received (step 401)across a network. The network may be, for example, a local area network(LAN) or the Internet. A PMIC tile is selected (step 402) in response.Steps 400-402 are performed by the ATSPCP tool 46.

FIG. 25 is a flowchart of a method 415. A first graphical representationof a first tile in a first position with respect to a second tile iscommunicated (step 410). A first response to the first graphicalrepresentation is received (step 411). In response to the firstresponse, a second graphical representation of the first tile in asecond position with respect to the second tile is communicated (step412). A second response to the second graphical representation isreceived (step 413). The second response may, for example, be anapproval of the second graphical representation. In response to thesecond response, physical layout data is generated (step 414) for anintegrated circuit that contains the first tile in the second positionwith respect to the second tile. Steps 410-414 are performed by theATSPCP tool 46.

FIG. 26 is a flowchart of a method 450. A graphical representation of afirst integrated circuit tile in a first position with respect to asecond integrated circuit tile is communicated (step 451). The graphicalrepresentation may, for example, be communicated across the Internet. Aresponse to the graphical representation is received (step 452) acrossthe network. In response, the graphical representation of the first tilepositioned with respect to the second tile is manipulated (step 453).Steps 451-453 are performed by the ATSPCP tool 46.

FIG. 27 is a flowchart of a method 425. A power management controlcharacteristic query is communicated (step 420). A user response to thequery is received (step 421) across a network. Tile configurationinformation is generated (step 422) based at least in part on the userresponse. Steps 420-422 are performed by the ATSPCP tool 46.

FIG. 28 is a flowchart of a method 436. A first control requirement isreceived (step 430) from a first entity. A type of MTPMIC is identified(step 431) from an inventory of already-fabricated MTPMICs. A first unitof the identified type is programmed (step 432) in a first way to meetthe first control requirement. A second control requirement is received(step 433) from a second entity. The same type of MTPMIC identified instep 431 is identified (step 434) from the inventory ofalready-fabricated MTPMICs. A second unit of the identified type isprogrammed (step 435) in a second way to meet the second requirement. Insome examples, the inventory is actual stock on hand. In other example,the inventory is a projection of available parts to be manufactured. Inone example, steps 430-435 are performed by a company such as a fablesssemiconductor company or supply house or distributor, and the first andsecond entities are customers of the company. The company uses theATSPCP tool 46 to determine how to program the first and second units.

FIG. 29 is a flowchart of a method 460. A power managementcharacteristic query is communicated (step 461). A user response to thequery is received (step 462) across a network. A first PMIC tile isprogrammed (step 463) based at least in part on the user response. ThePMIC tile forms part of a power management integrated circuit.

FIG. 30 is a flowchart of a method 470. A control requirement isreceived (step 471) from an entity across a network. In response, aplurality of PMIC tiles is identified (step 472) based at least in parton the control requirement. The tiles comprise a proposed PMIC. Productinformation is sent (step 473) across the network to the entityregarding the proposed PMIC. Steps 471-473 are performed by the ATSPCPtool 46.

FIG. 31 is a flowchart of a method 445. Tile configuration informationis communicated (step 440) from a first integrated circuit tile, througha second integrated circuit tile, and to a third integrated circuittile. The first, second, and third integrated circuit tiles are parts ofa MTPMIC. At least one of the first, second, and third integratedcircuit tiles is a power management integrated circuit tile.

In the described embodiments, a communication from any of the noveltools to an entity may be over a network such as the Internet or a LAN.However content may also be communicated to an entity from a displayrendering content generated by any of the novel tools executed directlyon the computer connected to the display. An entity may, for example, bea prospective customer, a user, a corporation, or any individual orgroup associated with a corporation. In the described embodiments, awebpage is used to communicate information. However, information mayalso be communicated over a plurality of webpages.

With a comprehensive tile library comprising production ready, provendesigns, PMICs may be put together without the need for traditionaldesign validation, without circuit simulation, and without DRC/LVSphysical design verification. It should be clear that the foregoingembodiments provide a substantially different approach from conventionaldesign methodologies (e.g., analog/digital standard IP libraries, etc.)at least in that the tiles of the preferred embodiment are of fixedsizes or of approximately fixed sizes, are programmableanalog/mixed-signal tiles, and are dimensioned and provided with portsto enable the smallest solution size and fastest time-to-market. Forexample, in one implementation instance of the preferred embodiment, allof the tile length and width dimensions are multiples of approximately0.5 millimeter with 0.5 millimeter I/O terminal pitch, as shown in FIG.3, with standard power, communication, and control buses, whichautomatically link up when the tiles are placed together. In this way,it is possible to very rapidly and easily put together a highlyintegrated Power Management Integrated Circuit, at least because thetile library is already set up with these efficiencies in mind.

Although certain specific exemplary embodiments are described above inorder to illustrate the invention, the invention is not limited to thespecific embodiments. Although an ATSPCP tool is described above thatperforms tile selection, placement, configuration, and programmingfunctions, an ATSPCP tool need not perform all of these functions oreven have a capability of performing all these functions. For example, auser can use an ATSPCP tool to perform tile selection and placementoperations. Once the placement is finalized, a second ATSPCP tool can beused to determine the configuration information and to program actualparts in inventory or to generate composite physical layout data forfabricating a satisfactory MTPMIC. Dongle 50 can be used to programMTPMICs at a central location where computer 30 is located such that theresulting programmed MTPMICs are then shipped to individual users.Alternatively, an individual user may use a dongle to program MTPMICs atthe user's remote location. The dongle may be, but need not be,connected to the same computer that executes ATSPCP 46. Accordingly,various modifications, adaptations, and combinations of various featuresof the described embodiments can be practiced without departing from thescope of the invention as set forth in the claims.

1. A method comprising: communicating tile configuration informationfrom a first integrated circuit tile, through a second integratedcircuit tile, and to a third integrated circuit tile, wherein the first,second and third integrated circuit tiles are parts of an integratedcircuit, and wherein at least one of the first, second, and thirdintegrated circuit tiles is a power management integrated circuit tile.2. The method of claim 1, wherein the first integrated circuit tile, thesecond integrated circuit tile, and the third integrated circuit tileare power management integrated circuit tiles.
 3. The method of claim 1,wherein the first integrated circuit tile includes a first bus conductorportion, wherein the second integrated circuit tile includes a secondbus conductor portion, wherein the third integrated circuit tileincludes a third bus conductor portion and a non-volatile memory cell,and wherein the tile configuration information is communicated throughthe first bus conductor portion and to the second bus conductor portion,through the second bus conductor to the third bus conductor portion, andthrough the third bus conductor portion and to the non-volatile memorycell.
 4. The method of claim 1, wherein the power management integratedcircuit tile is taken from the group consisting of: a buck convertertile, a boost converter tile, a low dropout regulator tile, a linearregulator tile, a battery charger tile, a charge pump tile, a batteryand power path management tile, a switching power controller tile, and alighting control module tile.
 5. The method of claim 1, wherein theintegrated circuit further comprises a master tile, and wherein themethod further comprises: communicating the tile configurationinformation from a bus conductor portion of the master tile to the firstbus conductor portion of the first integrated circuit tile.
 6. Themethod of claim 1, further comprising: communicating a reference voltagethrough the first bus conductor portion and to the second bus conductorportion, through the second bus conductor portion to the third busconductor portion, and through the third bus conductor portion to afunctional circuit of the third integrated circuit tile.
 7. The methodof claim 1, further comprising: communicating a clocking signal throughthe first bus conductor portion and to the second bus conductor portion,through the second bus conductor to the third bus conductor portion, andthrough the third bus conductor portion to a functional circuit of thethird integrated circuit tile.
 8. The method of claim 2, wherein thesecond bus conductor portion includes a plurality of parallel extendingconductors that extend along a boundary of the second integrated circuittile.
 9. The method of claim 1, wherein the tile configurationinformation determines an output taken from the group consisting of: avoltage output by the third integrated circuit tile, and a currentoutput by the third integrated circuit tile.
 10. The method of claim 1,wherein the tile configuration information includes digital programmingdata useable to enable analog circuitry in the third integrated circuittile.
 11. The method of claim 1, wherein each of the first, second, andthird integrated circuit tiles includes a non-volatile register, andwherein the tile configuration information is loaded into thenon-volatile register in the third integrated circuit tile.
 12. Themethod of claim 1, wherein each of the first, second, and thirdintegrated circuit tiles includes an individually addressablenon-volatile register, and wherein the tile configuration information isloadable into a selectable one of the non-volatile registers.
 13. Themethod of claim 1, further comprising: communicating an addressattribute to identify the third integrated circuit tile wherein a busconductor communicating the address attribute is coupled to the first,second, and third integrated circuit tiles.
 14. An apparatus comprising:a first integrated circuit tile that includes a first bus conductorportion; a second integrated circuit tile that includes a second busconductor portion; and a third integrated circuit tile that includes athird bus conductor portion, wherein tile configuration information isconducted from the first bus conductor portion of the first powermanagement integrated circuit tile, through the second bus conductorportion of the second power management integrated circuit tile, and tothe third bus conductor portion of the third power management integratedcircuit tile, and wherein at least one of the first, second, and thirdintegrated circuit tiles is a power management integrated circuit tile.15. The apparatus of claim 14, wherein the third integrated circuit tileincludes an amount of non-volatile memory, and wherein the tileconfiguration information is loaded into the non-volatile memory.
 16. Anapparatus comprising: a first power management integrated circuit tile;a third power management integrated circuit tile; and a second powermanagement integrated circuit tile that includes a means for conductingtile configuration information from the first power managementintegrated circuit tile across the second power management integratedcircuit tile and to the third power management integrated circuit tile.17. An integrated circuit comprising: (a) a first integrated circuittile; (b) a terminal connected to the first integrated circuit tile; and(c) a standardized bus, wherein the first integrated circuit tile can beaddressed via the standardized bus, and wherein the standardized buscarries a clocking signal and communicates a data signal to store tileconfiguration information in the first integrated circuit tile.
 18. Theintegrated circuit of claim 17, wherein the first integrated circuittile is a member of a group of integrated circuit tiles and includes afirst bus portion, wherein a second integrated-circuit tile of the groupincludes a second bus portion, and wherein the first bus portion and thesecond bus portion connect to form the standardized bus if the firstintegrated circuit tile and the second integrated circuit tile aredisposed adjacent one another in an integrated circuit.
 19. Theintegrated circuit of claim 17, wherein the first integrated circuittile is taken from the group consisting of: a buck converter tile, aboost converter tile, a low dropout regulator tile, a linear regulatortile, a battery charger tile, a charge pump tile, a battery and powerpath management tile, a switching power controller tile, and a lightingcontrol module tile.
 20. An integrated circuit comprising: (a) aplurality of integrated circuit tiles, wherein at least one of saidintegrated circuit tiles has a power management function; (b) aterminal; and (c) a standardized bus, wherein the plurality of tiles canbe addressed via the standardized bus, and the standardized bus carriesat least one clocking signal and communicates a signal to store tileconfiguration information in a tile.
 21. The integrated circuit of claim20, wherein the standardized bus of (c) transmits the signal to storetile configuration information to a first integrated circuit tilethrough a second integrated circuit tile, wherein the first integratedcircuit tile is disposed adjacent to the second integrated circuit tilein an integrated circuit layout.
 22. An integrated circuit comprising: aterminal; and means for transmitting a signal to store tileconfiguration information in a first integrated circuit tile over astandardized bus, wherein the first integrated circuit tile and a secondintegrated circuit tile can be addressed via the standardized bus, andwherein the signal to store tile configuration information in the firstintegrated circuit tile passes through the second integrated circuittile to reach the first integrated circuit tile.